The various research topics on the ELECTRONIC PACKAGING area are:

 

• Heat transfer analysis in electronic packaging (A A O Tay, N E Wijeysundera, C Yap)
• Moisture effects in electronic packaging (A A O Tay)
• Heat transfer in phase change materials in thermal storage and electronics cooling (A S  Mujumdar)
• Thermomechanical reliability of IC packages (A A O  Tay)
• Wafer Level Packaging (A A O Tay)