Our group has a variety of characterization and fabrication facilities that will enable us to design advanced structures. Here we list down some of the major equipments most commonly utilized:

1) Atomic Force Microscopy

2) Surface Profiler 

3) Rotational Rate Table 

4) Micro Motion Analyzer

5) Probe Station

6) Wirebonding Packaging

7) Fabrication Processes

PSIA XE-100 Scanning Probe Microscope “ours is not just an AFM”  

The new XE series SPM was developed to have the following advantages: 1) Scan accuracy: There is no cross talk between the x-y and z axes, and one can achieve high scan accuracy. 2) Sample size: Since the sample is scanned by a flexure scanner only in the x-y direction, large samples as well as small samples can be scanned at sufficiently high speed. 3) Scan speed: Since the z scanner has a high resonance frequency with high force, the z servo frequency response is much greater than in conventional AFM. 4) Convenience: Since the laser beam aligning mechanism is fixed to the head, it is possible to produce alignment fixtures of adequate size for convenient and precise adjustment without requiring any tools. 5) Optical vision: Since there is enough clearance above the cantilever, it is possible to accommodate a direct on-axis optical microscope.

ZYGO NewView 5032 -Optical Profiler  “Advanced Surface Metrology”

The NewView 5000 is a "next generation" metrology system based upon proven, award-winning, and patented, technologies developed by ZYGO, by delivering precise, fast, accurate, 3-D area surface measurements with superior vertical resolution. It is an indispensable non-contact tool for determining the static surface and height profile in micromachined devices non-destructively. 

IDEAL AEROSMITH –Rate Table “Driving force for Inertial Testing”

The Series 1601-2 Automatic Positioning and Rate Table System is designed to provide precise position, rate and acceleration motion for the development and/or production testing of navigation sensor systems such as Micromachined Inertial Sensors, Fiber Optic Gyros (FOG), Ring Laser Gyros (RLG), Inertial Navigation Systems (INS) and accelerometers. Although originally designed for use in the aerospace/defense and commercial aviation industries, the advances in gyros and MEMS sensors have created a need for the test equipment in a wide variety of markets including the aerospace, defense, automotive, marine, navigation, communication, and oil exploration industries

MMA-300 Micro Motion Analyzer “Advancing Measurements by Light”

The MMA-300 Micro Motion Analyzer combines the award-winning MSV-300 Microscope Scanning Vibrometer with the PMA-300 Planar Motion Analyzer for in-plane analysis. Through this combination of laser Doppler vibrometry and stroboscopic video-microscopy, the dynamic behavior of MEMS devices can be completely characterized in all 3-dimensions.The data management system allows output in terms of Bode diagrams, step response plots, ring-down plots and displacement data.

ALESSI REL6100 –Probe Station “Innovating Test Technologies”

The REL-6100 Series Parametric Probe Station combines precision sub-micron probing capability with the superior measurement performance necessary for MEMS DC/CV analysis. The station features sub-micron resolution, precise motion control, and 8-inch travel. This instrument provides a tool for probing many MEMS devices with an electrical input/output or electrical input –optical output at the wafer or die level before packaging.

Kulicke & Soffa –Wire Bonder 4523AD “A Complete Connection”

MEMS devices range from 1 to 100 microns in diameter and are built on a silicon substrate. The device is "glued" into a package and wire bonded. These packages are critical and often very custom to the design. Package design plays a key role in device functionality and development, including initial prototyping of new design. For wire bonding of MEMS devices, we use manual wedge bonders from Kulicke & Soffa Model 4523AD. The bonding principle is by “pressing” under ultrasonic power. Our experience covers mainly bonding of Au-wires to Au, Al, or Cu bonding pads.

1)Photolithography 

2)Spin Coater 

3)Mask Aligner

4)Reactive Ion Etching

 5)Wet-bench processes