ALESSI REL6100 –Probe Station “Innovating Test Technologies”

The REL-6100 Series Parametric Probe Station combines precision sub-micron probing capability with the superior measurement performance necessary for MEMS DC/CV analysis. The station features sub-micron resolution, precise motion control, and 8-inch travel. This instrument provides a tool for probing many MEMS devices with an electrical input/output or electrical input –optical output at the wafer or die level before packaging.

Operating Principles

The diagram below describes the stages in a typical MEMS chip design and manufacturing process where wafer probe testing occurs. R&D wafers are probed during the design phase in engineering test. Good wafers proceed to the chip sort test stage where defective chips on the wafer are identified. The MEMS wafer is then diced into individual chips and defective chips are discarded and good chips are packaged.  Throughout the process some of the failed or defective wafers or chips are used as feedback in engineering design for better yield and/or failure analysis.