Nano-Wafer Level Packaging Program

Positions Currently Available

Positions Currently Available at the National University of Singapore:

Positions:

Research Fellow/Research Engineer (NEW!)

Posting Date:

15th December 2004

Requirements:







 

The candidate should possess a good Bachelor’s or Master’s degree (for Research Engineer) or a PhD (for Research Fellow) in Mechanical Engineering, Materials Science or Chemical Engineering from a reputable University. The candidate for Research Engineer is expected to be intimately familiar with finite element analysis and have experience in using finite element codes, preferably ABAQUS. Experience in writing computer codes will be an advantage. The applicant for Research Fellow should in addition be competent in multiscale modelling, atomistic modelling, molecular dynamics, materials modeling and finite element modelling. Experience in simulation of processes or reliability of electronics packaging will be an advantage.
Job Description: The successful candidate will be required to work in the Department of Mechanical Engineering at the National University of Singapore. He or she will be expected to perform modelling and simulation of either reliability of electronic packages (fracture, delamination, fatigue) or interfacial phenomena and self-assembly processes. Some experimental work eg testing of mechanical or materials properties may also be carried out.

Duration:
 

The appointment is available immediately and will be tenable for 1 to 3 years.

 

Position:

Research Engineer (NEW!)

Posting Date:

15th December 2004

Requirements:



 

The candidate should possess a good Bachelor’s or Master’s degree in Mechanical Engineering, Materials Science or Chemical Engineering from a reputable University.  The candidate should be experienced in conducting experiments and processes associated with electronics manufacturing especially in solder reflow or solder bumping, and should be innovative and good at designing fixtures.
Job Description: The successful candidate will be required to work in the Department of Mechanical Engineering at the National University of Singapore. He or she will work as part of the Nano Wafer Level Packaging research group and will be expected to perform modelling and simulation of either reliability of electronic packages (fracture, delamination, fatigue) or interfacial phenomena and self-assembly processes. Some experimental work eg testing of mechanical or materials properties may also be carried out.
Duration:

The appointment is available immediately and will be tenable for a period of about one year.
 
Position: Research Fellow/Research Engineer (NEW!)
Posting Date: 15th December 2004
Requirements:

The candidate should possess a good Bachelor’s or Master’s degree (for Research Engineer) or a PhD (for Research Fellow) in Mechanical Engineering, Materials Science or Chemical Engineering from a reputable University. The candidate should be experienced in processing and characterization of materials preferrably nanostructured materials, and with testing of mechanical properties of materials. The candidate should be innovative and good at experimental work.

Job Description:

The successful candidate will be required to work in the Department of Mechanical Engineering at the National University of Singapore. He or she will work as part of the Nano Wafer Level Packaging research group and will be expected to develop processes in fabricating chip-to-substrate interconnections, and in characterization of materials properties and reliability.
Duration:

The appointment is available immediately and will be tenable for a period of about one year.
Other Terms & Conditions:

Gross monthly salary will commensurate with qualifications and experience. Leave and medical benefits will be provided. Candidates of all nationalities will be considered for this position.

Applications:
 

 

 

IInterested candidates should e-mail their detailed curriculum vitae giving full details of research experience and full publication list, to:

Professor Andrew Tay,
Program Manager, Nano Wafer Level Packaging,
Department of Mechanical Engineering.
E-mail: mpetayao@nus.edu.sg

We regret that only short-listed candidates will be notified.
 

The NWLP Group is  Continually Looking for Talented Individuals to Fill the Following Positions:

  • Research Fellows

  • Research Engineers

  • Research Scholars

Educational and Research Experience is Required in the Following Areas:

  • Nano-Structured Materials:
    Processing, Characterisation, Testing and Simulation.

  • Modelling and Simulation:
    Thermo-Mechanical Finite Element Modelling; Materials, Reliability and Process Modelling;  Molecular Dynamics; Multi-Scale Modelling.

  • Electrical Design:
    Experimental Testing; Electro-migration; High Speed Digital and RF Modelling.

  • MEMS Design and Fabrication.

For all Enquiries, Please E-mail:   Professor Andrew Tay

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