International Journal Papers:

1.      M.B. Cai, X.P. Li and M. Rahman, Study of the temperature and stress in nanoscale ductile mode cutting of silicon using molecular dynamics simulation, Journal of Materials Processing Technology. (Accepted for Publication)

2.       S. Arefin, X.P. Li, M.B. Cai, M. Rahman, K. Liu, A.A.O. Tay, Effect of cutting edge radius on machined surface in nanoscale ductile mode cutting of silicon wafer,  Proceedings of the Institution of Mechanical Engineers Part B – Journal of Engineering Manufacture, Vol. 221, 2007.

3.       M.B. Cai, X.P. Li and M. Rahman, Study of the mechanism of groove wear of the diamond tool in nanoscale ductile mode cutting of monocrystalline silicon, Transactions of the ASME- Journal of Manufacturing Science and Engineering, Vol. 129, April 2007.

4.       M.B. Cai, X.P. Li and M. Rahman, Characteristics of "dynamic hard particles" in nanoscale ductile mode cutting of monocrystalline silicon with   diamond tools in relation to tool groove wear, Wear. (Accepted for Publication)

5.       S. Arefin, X.P. Li, M. Rahman, K. Liu, The upper bound of tool edge radius for nanoscale ductile mode cutting of silicon wafer, International Journal of Advanced Manufacturing Technology. (Accepted for Publication)

6.      M. Sharif Uddin, K.H.W. Seah, M. Rahman, X.P. Li and K. Liu. Performance of single crystal diamond tools in ductile mode cutting of silicon. Journal of Materials Processing Technology. (Accepted for Publication)

7.        M.B. Cai, X.P. Li and M. Rahman, Molecular dynamics modeling and simulation of nanoscale ductile cutting of silicon, International Journal of Computer Applications in Technology, Vol. 28, No.1, pp. 2-8, 2007.

8.     M.B. Cai, X.P. Li and M. Rahman, A.A.O. Tay, Crack initiation in relation to the tool edge radius and cutting conditions in nanoscale cutting of silicon, International Journal of Machine Tools & Manufacture, Vol. 47, pp. 562-569, 2007.

9.       K. Liu, X.P. Li and S.Y. Liang. The mechanism of ductile chip formation in cutting of brittle materials. International Journal of Advanced Manufacturing Technology. (In Press)

10.  K. Liu, X.P. Li and M. Rahman. Characteristics of ultrasonic vibration assisted ductile cutting of tungsten carbide. International Journal of Advanced Manufacturing Technology. (In Press)

11.  K. Liu, X.P. Li, M. Rahman, K.S. Neo, and X.D. Liu. A study of the effect of tool cutting edge radius on ductile cutting of silicon wafers. International Journal of Advanced Manufacturing Technology. (In Press)

12.  M.B. Cai, X.P. Li and M. Rahman, Study of the mechanism of nanoscale ductile mode cutting of silicon using Molecular Dynamics simulation, International Journal of Machine Tools & Manufacture, Vol. 47, pp. 75-80, 2007.

13.  M.B. Cai, X.P. Li and M. Rahman, Molecular dynamics simulation of the effect of tool edge radius on cutting forces and cutting region in nanoscale ductile cutting of silicon, Int. J. Manufacturing Technology and Management, Vol. 7, No.5-6, pp. 455-466, 2005.

14.  X.P. Li, T. He, M. Rahman, Tool wear characteristics and their effects on nanoscale ductile mode cutting of silicon wafer, Wear, Vol. 259, pp. 1207–1214, 2005.

15.  Kui Liu, Xiaoping Li, Steven Y Liang, Xiang Dong Liu, Nanometer-Scale, Ductile-Mode Cutting of Soda-Lime Glass, Journal of Manufacturing Processes, Vol.7, No.2, pp.95-101, 2005.

16. S. Arefin, X.P. Li, M. Rahman, T. He, Machined surface and subsurface in relation to cutting edge radius in nanoscale ductile cutting of silicon, Transactions of NAMRI/SME, Vol. 33, 2005.

17.  K. Liu, T. He, X.P. Li and M. Rahman. A method of atomic dynamic modeling for nanometric ductile cutting of silicon wafer material. International Journal for Manufacturing Science and Technology, Vol. 6, No.1, pp. 25-33, January 2005.

18.  K. Liu, X.P. Li and S.Y. Liang. Nanometer-scale, Ductile-cutting of tungsten carbide. Journal of Manufacturing Processes, Vol.6, No.2, pp.187-195, 2004.

19.  K. Liu, X.P. Li, S.Y. Liang and X.D. Liu. Nanometer scale ductile mode cutting of soda-lime glass, Transactions of NAMRI/SME, Vol. 32, pp. 39-45, 2004.

20.  K. Liu, Y. Li, X.P. Li and M. Rahman. Ultra precision cutting of tungsten carbide in ductile mode using CBN tools. Nanotechnology and Precision Engineering, Vol. 2, No. 3, pp. 234-241, October 2004.

21.  M. Sharif Uddin, K.H.W. Seah, X.P. Li, M. Rahman and K. Liu. Effects of crystalline orientation on wear of diamond tools for nano-scale ductile cutting of silicon. Wear, Vol. 257, No. 7-8, pp. 751-759, 2004.

22.  K. Liu, X.P. Li, M. Rahman and X.D. Liu. Study of ductile mode cutting in grooving of tungsten carbide with and without ultrasonic vibration assistance. International Journal of Advanced Manufacturing Technology, Vol. 24, pp. 389–394, 2004.

23.  K. Liu, X.P. Li, M. Rahman and X.D. Liu. A study of the cutting modes in grooving of tungsten carbide. International Journal of Advanced Manufacturing Technology, Vol. 24, pp. 321–326, 2004.

24.   K. Liu, X.P. Li, M. Rahman and X.D. Liu. CBN tool wear in ductile cutting of tungsten carbide. Wear, Vol. 255, No. 7-12, pp. 1344-1351, 2003.

25.   K. Liu, X.P. Li and M. Rahman. Characteristics of high speed micro ductile cutting of tungsten carbide. Journal of Materials Processing Technology, Vol. 140, No. 1-3, pp. 352-357, 2003.

26.  K. Liu, X.P. Li and S.Y. Liang. Nanometer scale ductile cutting of tungsten carbide. Transactions of NAMRI/SME, Vol. 31, pp. 153-160, 2003.

27.   X.P. Li, M. Rahman, K. Liu, K.S. Neo and C.C. Chan. Nanoprecision measurement of diamond tool edge radius for wafer fabrication. Journal of Materials Processing Technology, Vol. 140, No. 1-3, pp. 358-362, 2003.

28.  K. Liu and X.P. Li. Ductile cutting of tungsten carbide. Journal of Materials Processing Technology, Vol. 113, No. 1-3, pp. 348-354, 2001.

29.  K. Liu and X.P. Li. Modeling of ductile cutting of tungsten carbide. Transactions of NAMRI/SME, Vol. 29, pp. 251-258, 2001.

30.  H.Z. Li, K. Liu and X.P. Li. A new method for determining the undeformed chip thickness in milling. Journal of Materials Processing Technology, Vol. 113, No. 1-3, pp. 378-384, 2001.

 Conference Papers:

1.   M.B. Cai, X.P. Li and M. Rahman, Study of the temperature and stress in nanoscale ductile mode cutting of silicon using molecular dynamics simulation, Proceedings of the 7th Asia Pacific Conference on Materials Processing, Singapore, 4-6 December, 2006.

2.     X.P. Li, M.B. Cai and M. Rahman, Study of nanoscale ductile mode cutting of silicon using molecular dynamics simulation, Proceedings of the 7th International Conference on Frontiers Design and Manufacturing, Guangzhou, pp. 391-394, China, June, 2006.

3.       M.B. Cai, X.P. Li and M. Rahman, Study of the crack initiation in nanoscale ductile mode cutting of silicon by molecular dynamics simulation, Proceedings of 2006 International Symposium on Flexible Automation, pp. 85-91, Japan, July 9-14, 2006.

4.       M.B. Cai, X.P. Li and M. Rahman, Molecular dynamics simulation of the effect of tool edge radius on cutting forces and cutting region in nanoscale ductile cutting of silicon, In: Proceedings of the Thirteenth International Conference on Processing and Fabrication of Advanced Materials, Singapore, 6-8 December, 2004.

5.       S. Arefin, K. Liu, X.P. Li and M. Rahman. Cutting conditions and tool edge radius for nanoscale ductile cutting of silicon wafer. Proceedings of 2004 Japan-USA Symposium on Flexible Automation, Denver, Colorado, USA, UL_031, July 19-21, 2004

6.      M. Sharif Uddin, K.H.W. Seah, M. Rahman, X.P. Li and K. Liu. Wear behaviour of single crystal diamond tools in ductile mode cutting of silicon wafer materials, Proceedings of The 3^rd International Conference on Advanced Manufacturing Technology, pp. 209-215, Kuala Lumpur, Malaysia, May 11-13, 2004.

7.      T. He, K. Liu, X.P. Li and M. Rahman. A Method of Atomic Dynamic Modeling for Nanometric ductile cutting of Silicon Wafer Material. Proceedings of International Conference on Precision Engineering 2003/2004, pp. 409-417, Singapore, March 2-5, 2004.

8.    K. Liu and X.P. Li. Nano scale ductile cutting of brittle materials for wafer fabrication. Workshop on High Speed Machining of Hard/Super Hard Materials sponsored by JSME-NUS, Copthorne Orchid Hotel, Singapore, November 7-11, 2003

9.     K. Liu, X.P. Li, M. Rahman and X.D. Liu. Study on surface topography in nanometric ductile cutting of silicon wafers. Proceedings of 4^th Electronics Packaging Technology Conference, pp. 200-205, Singapore, December 10-12, 2002

10.       K. Liu, X.P. Li and M. Rahman. Ultrasonic vibration assisted cutting of tungsten carbide. The 10^th International Manufacturing Conference in China, Xiamen, China, Panel 1-202, October 11-13, 2002

11. K. Liu, X.P. Li, M. Rahman and X.D. Liu. The critical conditions for ductile chip formation in grooving of tungsten carbide. Proceedings of 2002 Japan-USA Symposium on Flexible Automation, Volume I, pp. 157-161, Hiroshima, Japan, July 14-19, 2002

12.  K. Liu, X.P. Li, M. Rahman and X.D. Liu. Improving ductile mode cutting of tungsten carbide by ultrasonic vibration. Proceedings of 2002 Japan-USA Symposium on Flexible Automation, Volume I, pp. 151-156, Hiroshima, Japan, July 14-19, 2002

13. K. Liu, X.P. Li, M. Rahman, C.C. Chan and X.D. Liu. Nanomachining technology for wafer fabrication. Workshop on NanoScience and Engineering, IMRE, NUS, Singapore, January 23-24, 2002.

Note: If you want to get the papers, please contact Prof. Li Xiaoping (mpelixp@nus.edu.sg)