Nanomachining Technology

Nanomachining is a newly developed technology for machining engineering materials with the undeformed chip thickness in nanometric scales.

Nanomachining technology can be used to achieve ductile mode cutting with smooth surface and free of cracks for brittle materials, especially for semiconductor materials, such as silicon, quartz, glass and ceramic.

Here, silicon wafer material is selected as the main nanomachining workpiece material due to its worldwide applications. A smooth wafer surface free of cracks will be achieved by using the nanometric ductile cutting technology for brittle materials.

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